Laser burr removal device
Introducing a laser deburring device capable of removing resin from metal parts!
The "Laser Resin Removal Device" is a device designed to remove excess black resin parts from various semiconductor products. It is capable of removing resin from metal parts, separating products, and removing resin gates from product sections. It supports products such as SOP series matrices, power modules, and TO-220/TO-3P series. 【Features】 ■ Removes excess black resin parts from various semiconductor products ■ Capable of removing resin from metal parts and separating products ■ Compatible with products such as SOP series matrices *For more details, please refer to the PDF document or feel free to contact us.
- Company：大洋電産 伊丹工場
- Price：Other
